Skip to main content

High Performance Wet Chemical

As device structures are being advanced, wet cleaning and etch steps become more critical in the chip-making process.
And It is required to develop an optimized product to customer’s process and to supply huge volume with consistent quality.
SK materials will be able to provide various wet chemical solutions in the near future by expanding its portfolio.

SK materials
  • High Selectivity Phosphoric AcidHSP

    An etching solution used in the 3D NAND memory manufacturing process that enables the selective etching of nitride layers in oxide/nitride stacks.

  • Tungsten Etchant 

    An etching solution used in 3D NAND memory production that enables the selective etching of tungsten thin films and diffusion barrier films.